Electro-static chucks hold the wafer in place by pulling a uniform force across the entire wafer. A common problem with mechanical clamping is bowing or distortion of the wafer. When the wafer is clamped mechanically and process cooling gas is injected into the system, the center tends to bow upwards. This bowing creates a gap between the wafer and the e–chuck which then reduces the overall heat transfer leading to thermal non-uniformity and production losses.

Our e-chucks provide for a uniform force across the entire wafer, ensuring that it sits completely flat during the entire process cycle. As a result the gap between the wafer and the e-chuck surface is minimized, thus improving the overall thermal uniformity.

 

We work with leading developers to manufactur and supply Electro-static Chucks to the Semiconductor Industry worldwide, with Core technology on the Electro-static Chuck Business. We have been supplying OEMs since 1991 and End Users since 1997.

Our manufacturers refurbish 250 different e-chucks and complete turnkey substrate clamp and control systems for a variety of applications including:

• Plasma Etch: Oxide, Poly & Metal
  • AMAT, LAM, TEL and Hitachi Etchers
• PVD
  • AMAT Endura and Novellus INOVA
• HDP CVD
  • AMAT Ultima and Novellus Speed
• Inspection and Lithography

We supply OEM copy exact e-chucks for 150 mm/200 mm/300 mm platforms with guaranteed performance that is equivalent, or in many cases, improved over the EM supplier.

All ESC’s manufactured, re-manufactured or refurbished are guaranteed:

• Form, fit and function compatible
  • No hardware or software modification

• Process compatible

• • No process shift or change
• Equal or better lifetime than new OEM ESC
  • Same warranty as OEM on New ESC

We provide full process, applications and integration support to ensure all ESCs meet the customer’s demanding requirements.

Please contact us directly for the technical details and quote for all of your e-chuck requirements.