New product release has gained excellent acceptance world wide in the Wafer fabs that have implemented this new assembly.

It's simple design, yet effective results has yielded a U.S. Patent Pending #20100167544A1 for which ACS is licensed to manufacture.

Although this may be a new product introduction — this assembly has been implemented in fab's around the world and has demonstrated outstanding results for years — both in productivity and yield.

ACS worked directly with the originator of the design to manufacture initial prototypes and have been supporting production of this product for several years.

 

The Problem:

• Polymer build-up forms in the top of the door tunnel.
• After time, the build-up begins to hang from the top of the tunnel.
• When pushing RF hours, flakes come in contact with the surface of the wafer causing particles and resultant yield loss.

 

The Solution:

• Grooves were designed into the top of the tunnel — dimensions of grid pattern were approximately the same size of an average size of polymer flake and can be modified or changed in configuration.
• The grooves are there to give the polymer a rough surface gap to adhere to. Polymer builds up into the grooves, allowing extended periods of process without particle generation or frequent cleaning. Hence, prolonging the time before cleans and minimizing particles.
• Reduction in particles and significantly improving MTBC. Results increase productivity and yield enhancement.

 

MTBC typically has been 375 RF hours, compared to 1,200+ RF hours with the fully integrated Door and Tunnel Assembly.

Pending process conditions, this tunnel configuration has yielded stringer-free conditions from 800 RF hours to as much as 1,500 RF hours.

In addition to the grid, the tunnel has a WIDE surface face for the mating door compared to the traditional raised edge. This provides a better seal, adding more benefits in minimizing polymer build up.

• Improved productivity
• Reduced particles
• Higher yield
• Excellent payback

Ultima Plus HDP-CVD RPS Dome Conversion

• Ultima Plus HDP-CVD Technology
• Enhanced System with Remote Plasma Source Cleaning Capability
• Reduce Clean Time and gas consumption
• Increase throughput
• Reduce cost of ownership
• RPS Dome Conversion
  • Ultima Dome 0200-18062 must be replaced with Ultima RPS Dome 0200-01006
  • New Dome has larger hole for remote plasma cleaning
  • High cost to replace Dome
  • Low Cost Alternative:  Dome Conversion Process